FINETECH FINEPLACER pico rs Advanced High Density Rework System
產品查詢FineTech FINEPLACER pico rs Advanced High Density Rework System
Advanced Rework Applications
• BGA, μBGA, CSP, QFN, PoP, QFP, PGA,
• Small Passives (0201, 01005)
• RF shields, RF frames
• Connectors, sockets
• C4 Flip Chip
• Reworkable Underfill, conformal coating
• Single Ball Rework
Features
• Automated soldering processes• Modular design
• Vision alignment system with fixed beam splitter
• Integrated Process Management (IPM)
• Real time process observation camera
• Process transfer from system to system
• High level of application flexibility
• Highest placement accuracy
