FINETECH FINEPLACER pico rs Advanced High Density Rework System

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FineTech FINEPLACER pico rs Advanced High Density Rework System
Advanced Rework Applications

• BGA, μBGA, CSP, QFN, PoP, QFP, PGA,
• Small Passives (0201, 01005)
• RF shields, RF frames
• Connectors, sockets
• C4 Flip Chip
• Reworkable Underfill, conformal coating
• Single Ball Rework

Features

• Automated soldering processes
• Modular design
• Vision alignment system with fixed beam splitter
• Integrated Process Management (IPM)
• Real time process observation camera
• Process transfer from system to system
• High level of application flexibility
• Highest placement accuracy​​​