SUE: UV Wafer Eraser or Curing / Cleaning System for 8” wafers with Automatic Loading
製品のお問い合わせThe system bed here is a tool intended to expose silicon wafers to UV radiation, with different possible applications depending on the type of UV lamps used
Features:
- UV radiation is used for erasing memories, curing chemicals, special dicing or grinding tape deactivation, and UVO cleaning
- UV unit integrated into the SIL8000 wafer loader system
- Designed for 8" wafers
- Utilizes 12 low-pressure UV tubes with electronic ballasts
- Uniform irradiation is achieved with a rotating chuck and adjustable chuck level
- Requires exhaust with at least 250 m3/h air extraction to remove ozone
- Transfers wafers one at a time under the UV source for programmed exposure time
- SUE control based on a PC system with a user-friendly touchscreen interface
- Recipe management for easy switching between different wafer thicknesses
- Different wavelength lamp options are available, such as 380 nm, for UV dicing tape curing
- One-click operation to start the system
Specifications:
| Wafer Size | • From 100mm to 200mm (two adjacent sizes at a time on request) |
| Carrier Detection | • Sensor on indexer platform |
| Ergonomic Carrier Placement | • H-Bar carrier mounting |
| Cassette Mapping | • Emitter-Receiver laser with wafer position measurement • Wafers detection from a minimum thickness of 180μm to 700μm |
| Safety Features | • Wafer protrusion detection • Cross-slot detection • Critical distance between wafers • LASER mapping with wafer thickness and distance measurement • Full faults detection and logging (electrical, vacuum, air) • Shutter for UV irradiation insulation |
| Wafer Handling | • Programmable movement speed • High-reliability carbon fiber end effector • High-precision cassette laser mapping |
| Wafer Thickness | • Standard wafers from 400μm to 600μm • Other thickness on request |
| Wafer Bow / Warpage | • < 0.1mm |
| Centering | • Mechanical pre-centering |
| Exposure Chuck | • Continuous rotation, programmable speed |
| Operator Interface | • 10.4” Touch screen and graphic intuitive interface • Windows 7 based |
| Control System | • PC based, with recipe management for optimal wafer handling and erasure |
| Networking | • SMB (Windows networking) |
| Communications Ports | • Ethernet • USB |
| Environment | • Class ISO4 cleanroom (ISO EN14644) compliant • CE Mark • SEMI standard compliant |
| Footprint | • 430 (W) x 800 (D) mm |
