SUE: UV Wafer Eraser or Curing / Cleaning System for 8” wafers with Automatic Loading

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The system bed here is a tool intended to expose silicon wafers to UV radiation, with different possible applications depending on the type of UV lamps used


Features:

  • UV radiation is used for erasing memories, curing chemicals, special dicing or grinding tape deactivation, and UVO cleaning
  • UV unit integrated into the SIL8000 wafer loader system
  • Designed for 8" wafers
  • Utilizes 12 low-pressure UV tubes with electronic ballasts
  • Uniform irradiation is achieved with a rotating chuck and adjustable chuck level
  • Requires exhaust with at least 250 m3/h air extraction to remove ozone
  • Transfers wafers one at a time under the UV source for programmed exposure time
  • SUE control based on a PC system with a user-friendly touchscreen interface
  • Recipe management for easy switching between different wafer thicknesses
  • Different wavelength lamp options are available, such as 380 nm, for UV dicing tape curing
  • One-click operation to start the system

Specifications:

Wafer Size • From 100mm to 200mm (two adjacent sizes at a time on request)
Carrier Detection • Sensor on indexer platform
Ergonomic Carrier Placement • H-Bar carrier mounting
Cassette Mapping • Emitter-Receiver laser with wafer position measurement
• Wafers detection from a minimum thickness of 180μm to 700μm
Safety Features • Wafer protrusion detection
• Cross-slot detection
• Critical distance between wafers
• LASER mapping with wafer thickness and distance measurement
• Full faults detection and logging (electrical, vacuum, air)
• Shutter for UV irradiation insulation
 Wafer Handling • Programmable movement speed
• High-reliability carbon fiber end effector
• High-precision cassette laser mapping
 Wafer Thickness • Standard wafers from 400μm to 600μm
• Other thickness on request
 Wafer Bow / Warpage • < 0.1mm
 Centering • Mechanical pre-centering
 Exposure Chuck • Continuous rotation, programmable speed
 Operator Interface • 10.4” Touch screen and graphic intuitive interface
• Windows 7 based
 Control System • PC based, with recipe management for optimal wafer handling and erasure
 Networking • SMB (Windows networking)
 Communications Ports • Ethernet
• USB
 Environment • Class ISO4 cleanroom (ISO EN14644) compliant
• CE Mark
• SEMI standard compliant
 Footprint • 430 (W) x 800 (D) mm