FINETECH FINEPLACER femto Micro Assembly system

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FineTech FINEPLACER femto Automated Sub-micron Bonder

• Placement accuracy 0.5 μm
• Component sizes up to 100²mm²
• Working area up to 450 x 150mm²
• Supports wafer up to 12”
• Bonding forces up to 500 N
• Small footprint and compact design