MIL8000 Wafer Inspection System and Microscope Loader

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MIL8000 wafer autoloader and macro inspection station represent the most effective system to automatically load wafers on a microscope and to perform a wafer front and backside macro inspection. It is a compact unit, which makes it possible to load wafers on a microscope and perform Macro Front and Back inspections.


Features:
  • Safe and reliable handling of thin wafers with high bow and warpage
  • Safety features for operator and process error protection
  • Carbon fiber end effectors for scratch-free handling
  • Simplified cassette profile definition with auto recipe tool
  • Automatic adaptation to different wafer thicknesses based on laser mapping sensor measurements
  • Multiple wafer selection methods for productivity and ease of use
  • Optimized control software for reduced cycle times
  • Programmable inspection types at carrier or wafer level (macro front-side, macro backside, micro)
  • Powerful computer control with a user-friendly touchscreen interface
  • Easy recipe management for handling configuration switching
  • One-click operation for streamlined workflow initiation

Specifications:

Wafer Size • 4ʺ, 5ʺ, 6ʺ, 8ʺ
• Handles two wafer sizes on the same machine
Carrier Detection • Sensor on indexer platform
Ergonomic Carrier Placement • H-Bar carrier mounting
Cassette Mapping • Emitter-Receiver laser with wafer position measurement
Safety Features • Wafer protrusion detection
• Cross-slot detection
• Critical distance between wafers
Wafer Handling • Programmable movement speed; carbon fiber end effector, micro holes check
   for macro and micro inspection
Wafer Thickness • Standard wafers from 200μm to 1000μm
Wafer Bow / Warpage • Up to 2mm (depending on wafer characteristics)
Centering • Optical, with no contact measurement of wafer position; overall precision<0.5mm
Alignment • Optical, on the micro chuck, with high compliance sensor; overall precision <2°
Throughput • > 100 wafers per hour (full thickness wafers, with critical speed reduced to ensure wafer safety)
MACRO FRONT Inspection • 45° motorized flip and rotation joystick adjustable and with programmable rotation speeds
MACRO BACK Inspection • Bernoulli contactless unit with wafer presence detection; programmable air flow for optimal handling,     joystick adjustable inclination
Illuminators for Macro Inspection • 2 LED pure green light sources with adjustable intensity
Microscope Interface • Microscope stage position the sensor and stage lock
Microscope Chuck • Wide area chuck for optimal wafer support, motorized rotation and automatic zero return before wafer loading and unloading
Cleanliness • Front side particle contamination:    < 0.1 particles cm²; (0.3μm)
• Backside particle contamination:      < 60 particles cm²;
• Front side scratches:                          0 defects added;
• Edge damages:                                  0 defects added;
• Metal contamination:                        < 210 atoms/ cm²
Operator Interface • Touch screen and graphic intuitive interface
Control System • PC based, with recipe management for optimal wafer handling
Type of Wafer Selection • Programmable, with inspection recipe management and a direct graphical interface
 Inspection Type • MACRO FRONT, MACRO BACK, and MICROSCOPE, programmable for every single wafer in a carrier