EFEM 300mm advanced substrates & EFEM 450mm advanced substrates

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It allows automated loading of 300mm/450mm wafers into metrology and process chucks.


  • Compatible with main software controllers on the market
  • Compatible with standard silicon wafers, 3DIC (TSV / glass / stacks) & FO-WLP (mold compound / warped wafers)
  • Dual end effectors & dual aligners capability for fast wafer swap
  • Backside advanced Contact Technology
  • Front side and backside wafer ID readers
  • ISO Class 1 mini-environment
  • Leading edge cleanliness performance (particle / ion-metal / AMC)
  • SEMI standards compliant 
  • 2 or 3 Load Ports configuration
  • Compatible with all SEMI compliant FOUP / MAC / FOSB types